Huawei shared its future plans for semiconductor technologies during a conference in Shanghai. The company announced that it aims to produce chips with transistor density equivalent to 1.4 nanometers by 2031.

He Tingbo, head of Huawei’s semiconductor unit, stated that they will go beyond classical methods to achieve this goal. He stated that they are working on a new methodology that focuses on reducing signal transmission time instead of reducing transistor sizes.

New Methodology and Strategic Goals

Huawei, whose access to ASML’s advanced lithography machines is restricted due to the US embargo, is trying different ways to overcome these problems. The company plans to continue its technological progress with its own unique solutions in an environment where classical production techniques are becoming difficult.

Taiwan-based TSMC is expected to be the first company in the industry to switch to the 1.4 nanometer production process. TSMC aims to put this technology into operation in 2028 if there is no regional conflict.

Competition in Global Chip Manufacturing

TSMC is implementing a huge investment plan of 49 billion dollars within the scope of preparations for the transition to the 1.4 nanometer process. This investment includes the establishment of four new factories and production lines.

TSMC, which currently produces chips in the 2 nanometer production process, is accelerating its work to maintain its leadership in the sector. Huawei aims to stay in this competition with the new methodology it has developed, despite the embargo conditions.

What do you think about these controversial chip production targets set by Huawei for 2031?