Huawei, which leads the smartphone world by producing its own processors, is working intensively on the highly anticipated new generation Kirin 2026 series.

Details about the China-based technology giant’s new portable processor were revealed by reliable leak sources.

According to the leaked information, the Kirin 2026 series, which will come in two different versions, both standard and Pro, proves that the company continues its argument in the hardware market despite the embargoes.

Especially the core configuration of the Kirin 2026 Pro model and the new generation LogicFolding architecture implemented by Huawei in chip production manage to excite technology enthusiasts.

Leaked Core Features of Kirin 2026 Pro Processor

According to the details shared by the leaker named SuperDimensional on Weibo, the 5G-supported Kirin 2026 Pro processor offers a very strong infrastructure that balances performance and power efficiency.

The processor uses a total of nine cores in 1+4+4 format. The super large core (Super Large Core), reserved for the heaviest tasks, consists of 1 Taishan V4 performance core that can reach a peak frequency of 3.1 GHz.

As a reminder, the previous generation Kirin 9030 Pro processor included the Taishan V3 large core and this core ran at 2.75 GHz.

In other words, there is a significant leap in watch speeds in the new generation.

The performance-oriented middle core cluster, which handles medium-load processes, includes 4 Taishan V4 cores that are specially optimized for multi-threading and game loading times.

The small core cluster, which focuses on energy efficiency and is responsible for fast application launches with background missions, hosts 4 Taishan V4 Efficiency cores.

When we look at the graphics and artificial intelligence side, the situation seems quite challenging.

Leaks show that the chip includes a GPU unit with 8 compute units (8CU). For artificial intelligence processes, an NPU (Neural Processing Unit) infrastructure with 6 artificial intelligence cores is used. This NPU unit is claimed to offer a dual-layer processing power of 100 TOPs and 34 TOPs.

Design Revolution with LogicFolding and Tau Law

Huawei’s new processor makes a difference in the industry not only with its number of cores but also with its production ideology.

The company, which has limited access to the world’s most advanced EUV (Extreme Ultraviolet) lithography machines due to embargoes, applies its own Tau Scaling Law strategy instead of Moore’s Law to increase performance.

This new law, which focuses on temporal scaling and reducing signal delays instead of geometric reduction, comes to life with a 3D (three-dimensional) chip stacking architecture called LogicFolding.

LogicFolding technology allows more process units to be fitted into one square meter by arranging transistors in layers on top of each other instead of on a single plane.

Research and testing results show that Kirin 2026 Pro reaches a density of 238 million transistors per square millimeter (MTr/mm²).

This value means a huge transistor density that could theoretically rival TSMC’s 3nm or Intel’s 18A production nodes.

Shortening the signal paths ensures that the processor heats up less and the reaction time decreases dramatically.

It Will Come With Huawei Mate 90 Series

The question of when hardware enthusiasts will meet Kirin 2026 series processors is becoming clearer.

In line with the company’s flagship launch schedule, both the standard Kirin 2026 and Kirin 2026 Pro versions are expected to be unveiled at the Huawei Mate 90 series event to be held in the autumn.

It is among the leaks that the standard model will be equipped with features that are slightly different than the Pro version, but still provide high-level efficiency.