As smartphone chipsets become more complex from generation to generation, overheating issues that come with high performance also increase. Samsung brings a new solution to this situation with the Exynos 2600, offering an LPDDR5X RAM design that is half the size of standard modules but does not cause any loss of performance.

This new packaging standard aims to improve the thermal management of devices by going beyond classical formulas. This special LPDDR5X RAM module developed by Samsung is designed to work integrated with Exynos 2600.

New generation Heat Pass Block technology and hardware advantages

The traditional PoP (Package-on-Package) technique, an old technology in which the RAM chip is placed on the chipset, is being replaced by Samsung’s Heat Pass Block (HPB) system. This new technology may also become a standard in the future for manufacturers such as Qualcomm and MediaTek.

The shared images show that the LPDDR5X RAM chip used with the Exynos 2600 contains 15 pins instead of 18 and is physically much smaller. This design change allows for a more compact structure without loss of performance.

The HPB heat sink is positioned in a clear form on the 2nm silicon die. Considering that the Snapdragon 8 Elite Gen 6 Pro model will also use HPB technology, these new and small RAM modules are expected to be adopted by other manufacturers.

As smartphone chipsets become more powerful, advanced lithography techniques alone are not enough to solve heating issues. Although the A19 Pro chip in the iPhone 17 Pro Max model has a large vapor chamber, it is subject to thermal restriction at the 6W power limit.

Apple’s WMCM approach and the change in branch

Apple is moving away from classical methods in the A20 Pro chipset and switching to WMCM (Wafer-Level Multi-Chip Module) packaging technology. In this procedure, the DRAM chip is placed on the side of the silicon rather than on it, trying to increase thermal efficiency.

Although the system Samsung implemented with the Exynos 2600 is different from Apple’s approach, both companies agree that classical packaging techniques are no longer sufficient. The sector needs new physical arrangements for cooling high-performance chipsets.

Do you think these new chip packaging technologies in smartphones can completely solve the heating problem of devices?