Intel Core Ultra 5 400S Features Leaked
Intel's new Core Ultra 5 400S processors are assertive in gaming performance with their 144 MB cache capacity and 22-core structure.
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6 July 2026
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Technology
Huawei Mate XT 2 and Mate X8 Come with New Kirin 9050
Huawei Mate XT 2 and Mate X8 are preparing to be introduced in September with the new Kirin 9050 chipset and a battery capacity of over 6,000 mAh.
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6 July 2026
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Xiaomi Redmi Note 17 Series Comes with Powerful Batteries
Xiaomi is preparing to bypass the Redmi Note 16 and announce the Redmi Note 17 series with a huge battery. Technical details of the models that may come to Türkiye are in
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6 July 2026
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Galaxy Z Flip 8 and Z Fold 8 Series Prices Leaked
Leaked South Korean prices and sales calendar for Samsung's new foldable phones Galaxy Z Flip 8, Z Fold 8 and Z Fold 8 Ultra are in our news.
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6 July 2026
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Artificial Intelligence Era Begins in Samsung Exynos 2700 Processor
Samsung's new Exynos 2700 processor focuses on artificial intelligence and power efficiency rather than high benchmark scores. Here are all the details about the new generation Samsung processor.
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6 July 2026
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Hideo Kojima Worries About the Future of Physical Games
Hideo Kojima explained that he was concerned about the negative impact PlayStation's decision to abandon physical discs would have on the future of game ownership.
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6 July 2026
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Software Support Officially Ends for Nothing Phone (1)
Nothing announced that it has ended the software support for its first smartphone, Phone (1), with the July 2026 update. Details about the device's software life and beyond are here.
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6 July 2026
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New Platform Developed for Gallium Nitride Chip Design
Keysight and WIN Semiconductors have developed a new platform that accelerates gallium nitride chip design processes. It aims for high accuracy for 5G and satellite systems.
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6 July 2026
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New MacBook Pro Design Arrives Earlier Than Expected
Apple is preparing to launch entry-level MacBook Pro models with a new design and M7 processor in the spring of 2027. Here are the details.
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6 July 2026
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Huawei Switches to 3D Stacking Technology on 7 Nanometer Processors
Huawei announced that it has switched to 3D chip stacking and hybrid bonding technologies to increase performance in 7 nanometer processors.
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