Intel’s Technology Rivaling TSMC: Coming in 2027
Intel is competing with TSMC's CoWoS packaging with EMIB-T technology. The technology, which will enter production in 2027, promises a 50% cost advantage.
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5 August 2026
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"Packaging" with mapping relational writings
Waste Turns into Profit: Deposit System Started Across Türkiye
The deposit system, which started across Türkiye, provides 1 TL per bottle through packaging with the DOA logo. You can find the details of the application, usage steps and all the curious
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120
1 July 2026
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Could Intel’s New Technology Threaten TSMC?
According to the Citibank report, TSMC maintains its leadership in artificial intelligence chip production. Intel's EMIB-T technology, however, faces raw material constraints.
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174
15 May 2026
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iPhone 18 Processor is Bad News for Apple A20
Apple is giving up WMCM technology in the A20 processor it will use in the iPhone 18 due to DRAM shortage. Full details on costs and hardware changes.
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150
30 April 2026
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