A new research report published by Citibank reveals that TSMC’s market dominance over advanced packaging and chip manufacturing technologies will not face a serious threat anytime soon. Analysts predict that the demand for TSMC’s CoWoS packaging technology will increase significantly in 2026 and 2027, driven by growth in the artificial intelligence sector.

The company’s other advanced technologies such as SoIC and CoPoS are also expected to be in high demand in the coming years. These developments are among the key factors that will help TSMC maintain its strong position in the industry.

Intel’s EMIB-T Technology and ABF Substrate Dependency

While Intel is aggressively marketing its EMIB-T packaging technology, it is stated that large technology companies such as Google are also interested in this solution. While standard packaging technologies require silicon interlayers for signal transmission, Intel’s EMIB solution is based on an organic substrate structure.

The EMIB-T variant aims to reduce leaks by leveraging TSV technology to interconnect components. However, analysts emphasize that the success of this technology largely depends on the maturity of the ABF substrate ecosystem.

Given the constraints TSMC is experiencing in CoWoS production, whether ABF suppliers can increase production capacity will determine the scalability of EMIB technology. Intel’s success in this area seems to be directly related to the efficiency of this raw material supply chain.

TSMC’s Place in the Artificial Intelligence Industry is Solid

Another frequently discussed issue in the market is Intel’s 18-A production process and Apple’s interest in this technology. Citi analysts point out that trial production, which is a common practice in the industry, does not guarantee large-scale mass production in the future.

The research, which focuses on artificial intelligence and high-performance computing chips, states that the chip designs planned for 2027 and 2028 have already been finalized. This shows that TSMC’s current production strategies will continue to set market standards in the coming years.

Do you think Intel’s new packaging technologies will be able to shake TSMC’s leadership in the industry?