Due to supply shortages in the global DRAM market and increasing component costs, Apple decided to simplify the architecture of the A20 processor, which is planned to be used in the basic models of the iPhone 18 series. It is claimed that the WMCM (Wafer-level Multi-Chip Module) packaging technology, which creates great excitement in the technology world and allows the flexible combination of CPU and GPU cores, will remain exclusive to Pro models only due to costs.

While the current InFO technology is expected to be continued in the standard versions of the iPhone 18, which is expected to be released in the 2026-2027 period, it is predicted that this will have direct effects on the artificial intelligence performance and power efficiency of the device.

Apple’s Change in Strategy in Packaging Technology Draws Attention

Apple has long been combining components on a single die using TSMC’s InFO (Integrated Fan Output) packaging technology. However, with the A20, it was planned to switch to WMCM (Wafer-level Multi-Chip Module) technology, which offers a much more flexible structure.

This technology allows different units such as CPU, GPU and Neural Engine to be placed in a wide variety of combinations in a single compact package.

WMCM technology increases energy efficiency by ensuring that processor cores act independently and consume power only according to the task required.

One of the biggest advantages of this new architecture is that the RAM unit is placed directly on the processor layer, rather than next to the processor. This minimizes data transmission delays (latency), significantly increasing the overall speed and artificial intelligence processing capacity of the device. In addition, this structure, which does not require a silicone spacer, facilitates heat management and increases the connection density between components.

DRAM Costs Limit iPhone 18’s Hardware Features

According to information leaked from industry sources, the sharp increase in DRAM prices has left Apple facing difficult cost management. Details shared by tipster Jukan show that the standard A20 processor will have to give up WMCM technology due to these costs. It is stated that the main motivation for Apple to make this decision is to keep the memory cost per device under control.

Analysis reveals that a 12 GB LPDDR5 memory module will cost Apple $180 per unit in 2027.

This high cost table also weakens the possibility of the expected 12 GB RAM increase in standard iPhone 18 models. Instead of taking on such a high hardware cost in base models with low profit margins, Apple may choose to maintain the existing 8 GB RAM capacity.

This will cause the gap between base models and Pro models to widen, especially in on-device artificial intelligence (Edge AI) workloads.

The Advantages of WMCM Technology Continue to Preserve in Pro Models

Leaks indicate that Apple will continue to use WMCM packaging technology in the A20 Pro processor. This chipset, which will be included in the iPhone 18 Pro and Pro Max models, will offer higher performance thanks to advanced packaging. However, interestingly, no increase in RAM capacity is expected in Pro models.

It is stated that the company aims to establish an economic balance by using existing 12 GB LPDDR5 modules with WMCM packaging.

This strategy from Apple clearly shows how supply chain constraints in the hardware world affect even the largest companies. The thermal management advantages and high connection density that WMCM technology will bring will continue to be an important distinguishing feature for Pro users.

However, standard model users may have to settle for traditional packaging methods and limited memory capacities for a while.

What do you think about these hardware restrictions expected in the iPhone 18 series and Apple’s cost-oriented strategy? Share your opinions with us in the comments.