Samsung is making critical strategy changes in order to strengthen its competitive position in the smartphone market and increase the efficiency of the chipsets it produces. According to the latest leaks from industry sources, the company is preparing to make a radical packaging architecture change in the Exynos 2700 processor, which is planned to be included in the new generation flagship series Galaxy S27 and Galaxy S27 + models.

It is stated that Samsung will abandon the Fan-Out Wafer-Level Packaging (FOWLP), ie panel-level chip packaging technology, which it has used to optimize thermal performance since the Exynos 2400 series. It is planned to switch to side-by-side positioning architecture called Side-by-Side (SbS) instead of this technology, which negatively affects the company’s profit margin due to complex production processes and high costs.

• Packaging Technology is Changing:Samsung is stopping using the FOWLP technology, which it has preferred to ensure heat management since the Exynos 2400 model, in its new processor.

• Cost Focused Strategy:The excessive complexity and high cost of current WLP technology is leading the company towards the more sustainable and profitable Side-by-Side (SbS) architecture.

• New Heat Control System:In order to maintain thermal efficiency, an advanced heat dissipation block called Heat Pass Block (HPB) is integrated into the new processor architecture.

Why Is FOWLP Technology Abandoned?

FOWLP technology, developed by Samsung to compete with giant competitors such as TSMC in the mobile processor market, enabled the processor cores to be brought together in a thinner structure. This directly contributed to the smartphones heating up less even under intense load.

However, according to information from the industry, the production phase of this method creates serious cost burdens for the company. Low production efficiency and rising production expenses overshadow the commercial success of the Exynos series in the flagship market.

Samsung is embarking on new pursuits with the Exynos 2700 in order to both simplify its production processes and optimize its profit margin.

What Does Side-by-Side (SbS) Architecture and Heat Dissipation Technology Offer?

The new Side-by-Side (SbS) packaging design, which is expected to come to life in the Exynos 2700 processor, radically changes the layout of components in the processor architecture.

Side by Side Layout

Unlike classical vertical stacking or complex panel-level packaging methods, in the Side-by-Side architecture, the main application processor (AP) and volatile memory (DRAM) modules are positioned directly side by side, rather than on top of each other on the substrate. This reduces the margin of error on the production line and makes the assembly process of chips much faster and more economical.

Heat Pass Block (HPB) Integration

Placing chips side by side may cause some disadvantages in terms of thermal management compared to vertical placement. To prevent this problem, Samsung includes Heat Pass Block (HPB) technology in the Exynos 2700 design.

This special heat transfer block prevents performance losses and freezing by transferring the high heat produced by the processor cores directly to the cooling system of the device.

The Future and Expectations of the Galaxy S27 Series

We expect to see the first fruits of Samsung’s new generation processor strategy at the Galaxy Unpacked event held at the beginning of each year. It is estimated that the Exynos 2700 chipset will be at the heart of the Galaxy S27 and Galaxy S27+ models that will be available in global markets.

How the company will maintain its performance balance with this new packaging approach and whether it will reflect this cost advantage in device pricing are among the highly anticipated issues in the technology world.

If the new SbS architecture and HPB cooling block integration yields successful results, the Exynos series can completely put an end to the long-standing heating and efficiency criticisms.