New Design of Exynos 2700 Increases Thermal Efficiency!
Samsung Exynos 2700 increases memory bandwidth by up to 40 percent with its new SBS architecture and improved cooling system.
Samsung took an important step in thermal stability with the new generation cooler design used in the Exynos 2600 processor. The company is now preparing to take this success to the next level with the Exynos 2700 model.
The new generation Exynos 2700 draws attention with its innovative side-by-side (SBS) architecture and improved cooling system. This design change promises a significant increase in the memory bandwidth of the processor.
New SBS Architecture and Thermal Performance
Exynos 2700 is powered by SF2P technology, the next stage of Samsung’s 2nm GAA manufacturing process. Gate-All-Around architecture surrounds the transistor’s channel on four sides, providing better electrostatic control and low voltage threshold.
The new SF2P process offers 12 percent higher performance and 25 percent lower energy consumption compared to the previous generation SF2 node. The most striking change in the internal structure of the processor occurs in the layout.
In the Exynos 2600 model, the RAM was placed on top of the SoC and the heat spreader block was at the top of these layers. This sandwich-like design could cause heat to become trapped between the SoC and RAM.
With the Exynos 2700, Samsung places the RAM next to the SoC using Fan-out Wafer Level Packaging (FOWLP) technology. Thanks to this integration, connection paths are shortened and an increase of 30 to 40 percent in memory bandwidth is expected.
In addition, this new arrangement allows the heat spreader block to be positioned directly on both the SoC and the RAM. This significantly improves the overall thermal stability of the processor.
New Era in Snapdragon Competition
Exynos 2600 already exhibits higher thermal stability than Qualcomm’s Snapdragon 8 Elite Gen 5 processor. These new architectural innovations offered by Samsung with the Exynos 2700 enable the gap to widen further.
The company aims for a significant improvement in real-world performance with this design move. How do you evaluate what difference these technical advantages brought by Exynos 2700 will make in daily use?
